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Annual Review of Heat Transfer
Vish Prasad (open in a new tab) Department of Mechanical Engineering, University of North Texas, Denton, Texas 76207, USA
Yogesh Jaluria (open in a new tab) Department of Mechanical and Aerospace Engineering, Rutgers-New Brunswick, The State University of New Jersey, Piscataway, NJ 08854, USA
Zhuomin M. Zhang (open in a new tab) George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA

ISSN Print: 1049-0787

ISSN Online: 2375-0294

SJR: 0.363 SNIP: 0.21 CiteScore™:: 1.8

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MICROSCALE HEAT PIPES

pages 313-333
DOI: 10.1615/AnnualRevHeatTransfer.v14.190
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Краткое описание

The present work reviews microscale heat pipes that utilize the latent heat of a working fluid to dissipate high heat fluxes using a passive system with a low mass. Microscale heat pipes, which have arrays etched on a silicon wafer, are used to dissipate high heat fluxes from microelectronic components. To overcome the force of gravity and for space applications, capillary-pumped loops and loop heat pipes, which are thermal control and heat transport devices developed in the Soviet Union and United State, respectively, are often employed. Pulsating heat pipes transfer thermal energy from the heat source to the heat sink using a pulsating exchange of sensible heat inside a capillary tube.

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