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Архив
Proceedings of the 24th National and 2nd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2017)


ISBN Онлайн: 978-1-56700-478-6

HEAT TRANSFER AND FLUID FLOW STUDY OF CuO-W/EG(50:50) NANOFLUIDS THROUGH ALUMINIUM MICROCHANNELS

DOI: 10.1615/IHMTC-2017.2360
pages 1699-1704

Harkirat Sandhu
Department of Chemical Engineering, Chandigarh University, Mohali, Punjab, 140413, India

Dasaroju Gangacharyulu
Department of Chemical Engineering Thapar Institute of Engineering and Technology, Patiala, Punjab-147001, India

Аннотация

Modern nanotechnology provides new opportunities to nanofluids which can be used in various thermal systems to enhance their overall efficiency. In this paper, cooling performance of aluminium based rectangular microchannel heat sink (MCHS) using copper oxide-water/ethylene glycol (50:50) nanofluids are discussed. Experimental investigations of convective heat transfer and fluid flow are carried out at different heat inputs, Reynolds number and nanoparticle concentration. Sodium dodecyl sulphate (SDS) surfactant is used for preparing stable CuO nanofluids at various nanoparticle concentrations of 0.1, 0.5 and 1 vol %. Experimental findings confirm that there is an increase of 11-15 % in thermal conductivity of CuO-water/EG (50:50) nanofluids compared to respective base fluid with change in temperature from 30 °C to 70 °C and nanoparticle concentration. In comparison with thermal conductivity, insignificant rise in density and viscosity is observed. Due to this observation, pumping power cost for nanofluids approximately remains same as of base fluid but the rate of heat transfer get enhanced which will directly improve the efficiency of thermal system. Results showed that the convective heat transfer coefficients of CuO nanofluids are increased whereas friction factor is reduced with increase in Reynolds number and nanoparticles concentration. It can be concluded that Nusselt number of the nanofluids are increased by 47-66 % with increase in nanoparticle concentration when compared with the W/EG (50:50) base fluid. These results clearly show that microchannels thermal performance can be enhanced by using CuO nanofluids. Maximum 61 % heat was removed from MCHS by CuO nanofluids with 17 % enhancement in heat transfer in comparison with the base fluids.