Доступ предоставлен для: Guest
Портал Begell Электронная Бибилиотека e-Книги Журналы Справочники и Сборники статей Коллекции
International Journal for Multiscale Computational Engineering
Импакт фактор: 1.016 5-летний Импакт фактор: 1.194 SJR: 0.554 SNIP: 0.68 CiteScore™: 1.18

ISSN Печать: 1543-1649
ISSN Онлайн: 1940-4352

Выпуски:
Том 17, 2019 Том 16, 2018 Том 15, 2017 Том 14, 2016 Том 13, 2015 Том 12, 2014 Том 11, 2013 Том 10, 2012 Том 9, 2011 Том 8, 2010 Том 7, 2009 Том 6, 2008 Том 5, 2007 Том 4, 2006 Том 3, 2005 Том 2, 2004 Том 1, 2003

International Journal for Multiscale Computational Engineering

DOI: 10.1615/IntJMultCompEng.v8.i3.10
vii pages

SPECIAL ISSUE Multiscale Methods in Computer Materials Science

Maciej Pietrzyk
Faculty of Metals Engineering and Industrial Computer Science, AGH University of Science and Technology, al. Mickiewicza 30, 30-059 Kraków, Poland
P. D. Hodgson
Centre for Material and Fibre Innovation, Deakin University, Geelong, Victoria 3217, Australia
Tadeusz Burczynski
Institute of Fundamental Technological Research, Polish Academy of Sciences

Articles with similar content:

NOVEL CO2 CONTROL METHOD BY MEANS OF CO2 CHEMICAL LOOPING
International Journal of Energy for a Clean Environment, Vol.9, 2008, issue 1-3
E. J. Anthony, C. Salvador, J. C. Abanades, D. Lu
Atomistic Understanding of the Particle Clustering and Particle Size Effect on the Room Temperature Strength of SiC-Si3N4 Nanocomposites
International Journal for Multiscale Computational Engineering, Vol.8, 2010, issue 5
Han Sung Kim, Vikas Samvedi, Vikas Tomar
Mitigating elbow erosion with a vortex chamber
ICHMT DIGITAL LIBRARY ONLINE, Vol.0, 2015, issue
C. A. R. Duarte, F. J. Souza, V. F. Santos
BIPOLAR MOLECULAR OUTFLOWS IN THE STAR FORMING REGION IRAS 22267+6244
Radio Physics and Radio Astronomy, Vol.3, 2012, issue 1
Valery M. Shulga, A. V. Antyufeyev
FREE CONVECTION HEAT TRANSFER IN HORIZONTAL AND VERTICAL RECTANGULAR CAVITIES FILLED WITH NANOFLUIDS
International Heat Transfer Conference 13, Vol.0, 2006, issue
Christopher Yap, Arun S. Mujumdar, X. Q. Wang