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Heat Transfer Research

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ISSN Печать: 1064-2285

ISSN Онлайн: 2162-6561

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EFFECT OF OPERATING TEMPERATURE ON INTERFACE DIFFUSION AND POWER GENERATION OF BISMUTH TELLURIDE THERMOELECTRIC MODULES

Том 51, Выпуск 3, 2020, pp. 253-262
DOI: 10.1615/HeatTransRes.2019030539
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Краткое описание

High-temperature stability of interfaces between metal electrodes and thermoelectric (TE) materials is one of the main factors that restrict the reliability of TE modules. The interface diffusion behavior of the connector of copper (Cu), tin (Sn) solder, and bismuth telluride (Bi2Te3) TE material layers and its influence on the module-level Seebeck coefficient are investigated experimentally. The experimental results show that the thermal treatment temperature has a significant effect on the interface diffusion. In the service environment of thermoelectric modules at a high operating temperature, the interface diffusion occurs, resulting in lower carrier concentration in thermoelectric materials, lower Seebeck coefficient, and poorer module performance. The X-ray diffraction measurements show that the Ni concentration reduces as the thermal treatment temperature increases, and finally the compound of NiTe2 is formed, which results in the decrease of carrier concentration inside Bi2Te3. The scanning electron micrograph (SEM) of interface connection layer shows that Ni diffuses into Bi2Te3 TE materials and the thickness of interface connection layer increases significantly compared to the one without high-temperature thermal treatments. As the thermal treatment temperature increases, the layer thickness also increases. The output power of the TE modules degrades by 13.6% after 6-h thermal treatment at 200°C.

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ЦИТИРОВАНО В
  1. Ziolkowski Pawel, Blaschkewitz Przemyslaw, Müller Eckhard, Validation of commercial Bi2Te3-based thermoelectric generator modules for application as metrological reference samples, Measurement, 177, 2021. Crossref

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