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THERMAL PERFORMANCE AND FLOW CHARACTERISTICS IN A THIN ELECTRONICS CASING

DOI: 10.1615/IHTC13.p22.390
page 7

Shinji Nakagawa
Toyama Prefectural University, Toyama, Japan

Y. Nishino
Toyama Prefectural University, Toyama, Japan

Masaru Ishizuka
Toyama Prefectural University, 5180 Kurokawa, Imizu, Toyama 939-0398, Japan

Abstract

Flow in the model of a thin electronic equipment was measured using a PIV. Dummy components were placed in the model and those configurations were altered. The temperature rise of a heat source in the model was also measured and the cooling performance was examined. PIV measurement results clarified the change of flow depending on the configuration. The comparison of experimental results with numerical results shows a reasonable agreement.

IHTC-13 Digital Library

Measurement of fluid temperature with an arrangement of three thermocouples FLOW BOILING OF A HIGHLY VISCOUS POLYMER SOLUTION