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Annual Review of Heat Transfer
Vish Prasad (open in a new tab) Department of Mechanical Engineering, University of North Texas, Denton, Texas 76207, USA
Yogesh Jaluria (open in a new tab) Department of Mechanical and Aerospace Engineering, Rutgers-New Brunswick, The State University of New Jersey, Piscataway, NJ 08854, USA
Zhuomin M. Zhang (open in a new tab) George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA

ISSN Print: 1049-0787

ISSN Online: 2375-0294

SJR: 0.363 SNIP: 0.21 CiteScore™:: 1.8

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Clarivate CBCI (Books) Scopus Google Scholar CNKI Portico Copyright Clearance Center iThenticate Scientific Literature

THERMAL MANAGEMENT TECHNOLOGIES FOR 3D STACKED ICS

pages 199-244
DOI: 10.1615/AnnualRevHeatTransfer.2016011800
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ABSTRACT

Compared to planar integrated circuits (ICs), 3D stacked ICs as an emerging technology have significant advantages, including shorter interconnection length, smaller power consumption, and higher computation speed. However, chip stacking poses great challenges to thermal management. Three cooling technologies, namely, air cooling, passive immersion cooling, and intertier microfluidic cooling, are reviewed. Intertier microfluidic cooling is shown to be the most promising technology for future 3D stacked ICs due to its superior thermal performance and scalability. However, to fully utilize this technology, reliable fluid delivery systems and good heat transfer fluids are required. Three different fluidic interconnects, and criteria for heat transfer fluids selection for both single phase and two-phase cooling are discussed. It is concluded that extensive research on integration of intertier microfluidic cooling of 3D stacked ICs is still needed.

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