ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
This chapter reviews single-phase liquid flow in a promising and most relevant length scale for chip-level cooling−O(100 µm). Three rudimentary flow domains are presented and discussed including microchannels, micro pin-fin arrays, and microjets. Important aspects and effects that distinguish the heat transfer and fluid flow processes at the microscale from their large-scale counterparts are summarized and, when applicable, quantified. Channel flow is probably the topic most extensively studied at the microscale, and heat transfer and pressure drop in this fundamental flow domain have been quite extensively reviewed in recent years; therefore, only a very concise discussion is presented in this chapter. Microchannels are not completely ignored as they provide a baseline for the discussion of more advanced heat transfer domains. A review of all pertinent studies about pin fin arrays and microjet arrays is endeavored.
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Illustration of composite TIMs with a percolation of spherical nanoparticles, and high aspect ratio nanowires. NANOSTRUCTURED THERMAL INTERFACES
Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
The microchannel with a single pillar used by Jung et al., and an SEM image of the pillar with a flow control slit at 180 deg (facing downstream). ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Schematics of thermal boundary conductance calculations. NONEQUILIRIUM MOLECULAR DYNAMICS METHODS FOR LATTICE HEAT CONDUCTION CALCULATIONS
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