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TRANSIENT THERMAL AND HYDRODYNAMIC MODELS OF A FLAT HEAT PIPE FOR THE COOLING OF ELECTRONIC COMPONENTS

DOI: 10.1615/ICHMT.2008.CHT.1450
14 pages

R. Sonan
Laboratoire de Mécanique Énergétique, Université de Valenciennes et du Hainaut Cambrésis, 59313 - Valenciennes - France

Julien Pelle
Université de Valenciennes et du Hainaut-Cambrésis, TEMPO

D. Leger
Laboratoire de Mécanique Énergétique, Université de Valenciennes et du Hainaut Cambrésis, 59313 - Valenciennes - France

M. Fakes
Valeo Electrical Systems, 94017 - Créteil - France

Abstract

The transient performances of a flat heat pipe (FHP) used to cool several electronic components, are investigated in this work. The transient fluid flows both in wick and vapour core were computed with a transient 2D hydrodynamic model (T2DHM). This model is coupled with a transient 3D thermal model (T3DTM) of the FHP wall, which calculates the heat diffusion through the wall. The performed T2DHM is able to predict well the velocity and pressure distributions of the working fluid and then the FHP transient response. The capability of the FHP as a heat spreader is highlighted through a comparison with computational results on a solid copper plate. It is demonstrated that the FHP woks as a thermal spreader, with a much more uniform temperature distribution than the solid plate. The calculated pressure drop and velocity inside the FHP allow predicting some transient heat transfer limitations of the FHP.

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