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Proceedings of CONV-14: International Symposium on Convective Heat and Mass Transfer.
June, 8-13, 2014, Kusadasi, Turkey

DOI: 10.1615/ICHMT.2014.IntSympConvHeatMassTransf


ISBN Print: 978-1-56700-356-7

ISSN Online: 2642-3499

ISSN Flash Drive: 2642-3502

AN EXPERIMENTAL STUDY ON PERFORMANCE ENHANCEMENT OF CMOS COMPATIBLE MONOLITHIC MICROCHANNEL HEAT SINKS

pages 941-952
DOI: 10.1615/ICHMT.2014.IntSympConvHeatMassTransf.700
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ABSTRACT

A novel CMOS compatible monolithic microchannel heat sink has been fabricated and tested for single phase liquid cooling of electronic circuits. Experiments have been performed to investigate the heat transfer and pressure drop performance of the fabricated heat sinks. A figure of merit (FOM) definition for the microchannel heat sink has been introduced as the ratio of the heat removal to the pumping power. A minimum thermal resistance of 0.66 cm2·K/W with a corresponding heat flux of 128.5 W/cm2 and a FOM of 5735 have been obtained for a single-channel heat sink of 100 μm by 50 μm rectangular cross-section. Compared to those reported in the literature, the fabricated microchannel heat sinks have comparable or less thermal resistance values while carrying the advantages of monolithic design and CMOS compatibility. The proposed design has the highest FOM value among the CMOS compatible designs.

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