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MITIGATING HOT SPOTS IN PLANAR AND THREE-DIMENSIONAL (3D) HETEROGENEOUS MICROSYSTEMS USING LIQUID COOLING

DOI: 10.1615/ICHMT.2017.CHT-7.10
pages 1-7

Yogendra K. Joshi
Naval Postgraduate School, Monterey, CA 93943; G. W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA

Yuanchen Hu
Georgia Institute of Technology

Daniel Lorenzini
G.W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta, GA, USA

Abstract

We discuss techniques for hot spot mitigation using single phase liquid and two phase cooling, for both planar and 3D chips. In single phase flow through a finned microgap, the approach of fin clustering near hot spots is described. Heat transfer and pressure drop characteristics of various configurations are presented. For 3D stacked architectures, both fin clustering and tierwise flow variations for thermal control are discussed. Flow boiling in finned microgaps offers the potential of reduced mass flow rates, and temperature gradients compared to single phase forced convection, for handling non-uniform power maps. Three-dimensional, transient computations using the Volume of Fluids (VOF) approach for flow boiling are presented to explore selected strategies for hot spot mitigation. Comparisons of VOF predictions with experimental data gathered using microfabricated test structures are presented.

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