DOI: 10.1615/ICHMT.2017.CHT-7
ISBN Print: 9781-56700-4618
ISSN: 2578-5486
MITIGATING HOT SPOTS IN PLANAR AND THREE-DIMENSIONAL (3D) HETEROGENEOUS MICROSYSTEMS USING LIQUID COOLING
ABSTRACT
We discuss techniques for hot spot mitigation using single phase liquid and two phase cooling, for both planar and 3D chips. In single phase flow through a finned microgap, the approach of fin clustering near hot spots is described. Heat transfer and pressure drop characteristics of various configurations are presented. For 3D stacked architectures, both fin clustering and tierwise flow variations for thermal control are discussed. Flow boiling in finned microgaps offers the potential of reduced mass flow rates, and temperature gradients compared to single phase forced convection, for handling non-uniform power maps. Three-dimensional, transient computations using the Volume of Fluids (VOF) approach for flow boiling are presented to explore selected strategies for hot spot mitigation. Comparisons of VOF predictions with experimental data gathered using microfabricated test structures are presented.