DOI: 10.1615/ICHMT.2009.CONV
ISBN Print: 978-1-56700-261-4
ISSN Online: 2642-3499
ISSN Flash Drive: 2642-3502
USE OF A PHASE CHANGE MATERIAL (PCM)-BASED HEAT SINK FOR TRANSIENT THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS
ABSTRACT
This work deals with the melting natural convection in a rectangular enclosure heated from three discreet protruding heat sources (electronic components) mounted on a conducting vertical wall (substrate). The heat sources generate heat at a constant and uniform volumetric rate. A part of the power generated in the heat sources is dissipated to PCM (n-eicosane with melting temperature, Tm=36°C) that filled the enclosure. To investigate the thermal behaviour of the proposed heat sink, a mathematical model based on the mass, momentum and energy conservation equations were developed. Next, a numerical investigations were conducted, in order to examine the effect of the heat sources thicknesses on their secured working time, τmax , and liquid fraction, fmax, for a given values of the rest of governing parameters. Correlations for the non-dimensional secured working time (time to reach the threshold temperature, Tcr=75°C) and the corresponding melt fraction were derived.