THE OPTIMAL SPACING BETWEEN PARALLEL HEAT GENERATING BOARDS COOLED BY TURBULENT FORCED CONVECTIONDOI: 10.1615/ICHMT.2008.CHT.580 H. Yuncu ResumoThe main objective of this study is to maximize the total rate of heat transfer from the finite space occupied by the package to the air that flows through the package. Turbulent forced convection heat transfer in parallel heat generating boards in fixed volume of electronic package is investigated numerically. The boards are assumed to be equidistant and constant pressure head is maintained for the electronic package for varying spacing of heat-generating boards. Board surfaces with uniform temperature and uniform heat flux are considered. The optimal boar-to-board spacing that maximizes the total heat transfer rate removed by the turbulent flow of air is obtained by complete numerical simulation of the turbulent flow of air and temperature fields in each channel of fixed volume electronic package. |
Início - ICHMT DL | Ano atual | Arquivos | Comitê executivo | Centro Internacional para Transferência de Calor e Massa |