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Thermal Sciences 2004. Proceedings of the ASME - ZSIS International Thermal Science Seminar II
June, 13-16, 2004, Bled, Slovenia

DOI: 10.1615/ICHMT.2004.IntThermSciSemin


ISBN Print: 978-9-61913-930-1

Miniature Heat Pipes for Electronic Equipment Thermal Control

pages 429-435
DOI: 10.1615/ICHMT.2004.IntThermSciSemin.500
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RESUMO

An experimental investigation of flat and cylindrical miniature heat pipes (mHP) with different wick structures (sintered powder, mesh structure, wire bundle) was performed. Experimental results and predicting simulation software verification, particularities of testing are presented. Modelling, design, manufacturing and testing of cylindrical miniature copper/water heat pipe with diameter 4 mm and length 200 mm with copper sintered powder wick for notebook CPU and laser diodes thermal control was done. The Qmax for such a heat pipe is near 50 W.

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