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International Journal of Fluid Mechanics Research
ESCI SJR: 0.206 SNIP: 0.446 CiteScore™: 0.5

ISSN Imprimir: 2152-5102
ISSN On-line: 2152-5110

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International Journal of Fluid Mechanics Research

DOI: 10.1615/InterJFluidMechRes.v25.i4-6.230
pages 711-719

Natural Convection Heat Transfer from Electronic Components Located in an Enclosure

M. H. Esteki
School of Mechanical & Manufacturing Engineering, The University of New South Wales, Kensington, Australia
John Reizes
School of Mechanical and Manufacturing Engineering, UNSW-Sydney, Sydney 2052, Australia
Masud Behnia
School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney 2052, Australia

RESUMO

The problem of laminar natural convection cooling of electronic components located on a vertical substrate placed in a square enclosure filled with a fluid of Prandtl number equal to 0.71 corresponding to air is studied numerically. A commercially available general purpose CFD code, FLOW3D, was used to simulate the physical problem. Results have been obtained for a number of two dimensional geometries of realistic size conditions. The optional positions for the cooling of isothermal and constant heat flux plates are given.


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