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High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
SJR: 0.137 SNIP: 0.341 CiteScore™: 0.43

ISSN Imprimir: 1093-3611
ISSN On-line: 1940-4360

High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes

DOI: 10.1615/HighTempMatProc.2016017797
pages 115-126

MICROSTRUCTURE OF AMORPHOUS COPPER-CARBON THIN FILMS FORMED BY PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION

M. V. Astashynskaya
Research Laboratory, Department of Solid State Physics, Belarusian State University, 4 Nezavisimost Ave., Minsk, 220030, Belarus
Valiantsin V. Astashynski
Research Laboratory, Department of Solid State Physics, Belarusian State University, 4 Nezavisimost Ave, Minsk, 220030, Belarus
N. T. Kvasov
Research Laboratory, Department of Solid State Physics, Belarusian State University, 4 Nezavisimost Ave., Minsk, 220030, Belarus
Vladimir V. Uglov
Belarusian State University, 4 Nezavisimost Ave., Minsk, 220030, Belarus; National Research Tomsk Polytechnic University, 2a Lenin Ave., Tomsk, 634028, Russia

RESUMO

The microstructure of copper-carbon Cu/a−C:H nanocomposites formed by plasma-enhanced chemical vapor deposition has been determined by transmission electron microscopy. The formation of spherical copper inclusions embedded in the matrix of amorphous carbon was observed. The average size of the copper inclusions decreases from 16 to 5 nm on increasing the carbon concentration from 8 to 75 at.%. A description of the copper clusters formation processes in the reactor chamber was proposed. The results of calculation of the average size of copper clusters are in good agreement with the observed size of the copper inclusions formed in nanocomposite thin films.