International Heat Transfer Conference 13
ISSN Online: 2377-424X
ISBN CD: 1-56700-226-9
ISBN Online: 1-56700-225-0
THERMAL PERFORMANCE AND FLOW CHARACTERISTICS IN A THIN ELECTRONICS CASING
page 7
DOI: 10.1615/IHTC13.p22.390
要約
Flow in the model of a thin electronic equipment was measured using a PIV. Dummy components were placed in the model and those configurations were altered. The temperature rise of a heat source in the model was also measured and the cooling performance was examined. PIV measurement results clarified the change of flow depending on the configuration. The comparison of experimental results with numerical results shows a reasonable agreement.