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NANOSTRUCTURED THERMAL INTERFACES

DOI: 10.1615/AnnualRevHeatTransfer.2015011512
pages 47-99

John H. Taphouse
Georgia Institute of Technology, G.W. Woodruff School of Mechanical Engineering, 801 Ferst Drive, Atlanta, GA 30332-0405

Baratunde A. Cola
George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA


キーワード: thermal interface materials, nanomaterials, conduction

要約

The continual miniaturization and proliferation of electronics necessitates the development of thermal interface materials with unprecedented thermal and mechanical properties. Over the past decade, nanostructuring of thermal interface materials has emerged as a promising method for addressing this mounting problem. This chapter summarizes established methods for nanostructuring thermal interface materials and highlights emerging strategies.

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