要約

Heat dissipation necessity becomes an extremely important issue for electronics production, air-conditioning, LED cooling systems and refrigeration. The technology was developed to produce new loop polymer thermosyphons capable of long-term operation without permeation by air or working fluids through their walls. Suggested composite polymer materials with high thermal conductivity are employed as the case material and give possibilities to design a wide range of new heat transfer equipment. In this paper the flat horizontal polymer loop thermosyphon with flexible transport lines is suggested and experimentally tested. Its evaporator and condenser are reinforced with nano carbon filaments and nano particles to improve its thermal conductivity, durability and wettability. The rectangular capillary grooves inside the evaporator and condenser are used as a mean for the heat transfer enhancement. The working fluid is R 600. Thin film evaporation heat transfer for low heat load and two phase flow (vapor bubbles and liquid slugs) heat transfer for high heat load inside the evaporator are inherent for such thermosyphon.