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Heat Transfer Research
インパクトファクター: 0.404 5年インパクトファクター: 0.8 SJR: 0.264 SNIP: 0.504 CiteScore™: 0.88

ISSN 印刷: 1064-2285
ISSN オンライン: 2162-6561

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Heat Transfer Research

DOI: 10.1615/HeatTransRes.2018016611
Forthcoming Article

Experimental Study of Pool Boiling Heat Transfer on Micro-Pin-Finned Surface With Mechanical Oscillation

Jinjia Wei
State Key Lab of multiphase Flow, Xi'an Jiaotong Univerisity
Xin Kong
State Key Lab of multiphase Flow, Xi'an Jiaotong Univerisity
Jie Ding
State Key Lab of multiphase Flow, Xi'an Jiaotong Univerisity
Yonghai Zhang
State Key Lab of multiphase Flow, Xi'an Jiaotong Univerisity

要約

To further enhance pool boiling heat transfer , an new oscillation device was proposed. An oscillating plate was located over the heater surface with a vertical oscillation amplitude of 20mm and frequency of 6 HZ. Three N-type phosphorus-doped silicon chips were used as heater surfaces. One was smooth surface, and the other two were micro-pin-finned chips having fin thickness of 30 μm and fin height of 60 μm (chip PF30-60). The pin-fin arrays were fabricated with aligned and staggered arrangements respectively. Absolute ethyl alcohol was used as working fluid. The results showed that mechanical oscillation can enhance boiling heat transfer in both convective region and high flux region. The wall superheat showed a considerable decrease of 20-30 ℃ in the convective region by thinning the thermal boundary layer on heater surface, and the critical heat flux could also be increased by 20%. In addition, micro-pin-finned chips showed better performance due to much more fresh liquid supply from the interconnected tunnels formed by micro-pin-fins, which is driven by capillary force.