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Heat Transfer Research
インパクトファクター: 1.199 5年インパクトファクター: 1.155 SJR: 0.267 SNIP: 0.503 CiteScore™: 1.4

ISSN 印刷: 1064-2285
ISSN オンライン: 2162-6561

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Heat Transfer Research

DOI: 10.1615/HeatTransRes.2016010720
pages 617-632

FEASIBILITY OF THE ANGSTROM METHOD IN PERFORMING THE MEASUREMENT OF THERMAL CONDUCTIVITY IN VAPOR CHAMBERS

Chen-I Chao
Engineering and System Science, National Tsing Hua University, Hsinchu City, Taiwan
Wei-Keng Lin
Department of Engineering and System Science, National Tsing-Hua University, Hsinchu City, Taiwan
Shao-Wen Chen
Institute of Nuclear Engineering and Science and Department of Engineering and System Science, National Tsing Hua University, 101, Sect.2, Kuang Fu Road, Hsinchu, Taiwan 30013, R.O.C.
Han-Chou Yao
Engineering and System Science, National Tsing Hua University, Hsinchu City, Taiwan

要約

The present work investigates the feasibility of using the theoretical model of the Angstrom method for measuring the spreading of thermal conductivity in vapor chambers. A spreading thermal conductivity measuring platform that utilizes cooling modules with programed modulators to provide temperature modulation was designed, and Visual Basic and PLC-programable modulators were used in the development of a spreading thermal conductivity measuring programed for the feasibility studies involving vapor chambers. The present paper is divided into a 1D model and a 2D model according to the theoretical model of the Angstrom method, and theoretical analyses were conducted in both of those modes, respectively. In accordance with practical industrial requirements, a thermal diffusivity measuring platform and a heat capacity measuring system were designed. For the design of aspect ratio experiments, copper plates with different aspect ratios τ were used in the testing of measurement results from various theoretical models. Copper plates with aspect ratios τ smaller than 0.066 were used in the 1D model, while subjects with aspect ratios τ greater than 0.066 were used in the 2D model. The respective measurement results were obtained after applying these models to vapor chambers: a Module-11 copper vapor chamber exhibited a spreading thermal conductivity of 1390 W/m·K and a Module-N10 aluminum vapor chamber exhibited a spreading thermal conductivity of 608 W/m·K. These results, by expressing the spreading thermal conductivity of vapor chambers in numerical terms, also indicated that the purpose of this study was successfully achieved.


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