年間 18 号発行
ISSN 印刷: 1064-2285
ISSN オンライン: 2162-6561
Indexed in
A NOVEL LIQUID-PACKAGING TECHNOLOGY FOR HIGHLY RELIABLE UV-LED ENCAPSULATION
要約
This paper proposes a liquid-packaging technology for UV LED. Unlike the traditional packaging methods that involve thermosett ing silicon or quartz glass, the proposed method primarily uses silicon oil to directly contact the chip, which prevents erosion due to moisture or oxygen. In this study, UV LEDs with high heat dissipation technology were selected, and the experimental results of optical and thermal management were compared between the general packaging and liquid-packaging structures, respectively. The results of the optical experiments showed that the proposed method increases the extraction effi ciency by 9.5%. The results of the heat dissipation experiments showed that the liquid-packaging technology can reduce the thermal resistance of the UV-LED package by 31%.
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Kang Chieh-Yu, Lin Chih-Hao, Wu Tingzhu, Lee Po-Tsung, Chen Zhong, Kuo Hao-Chung, A Novel Liquid Packaging Structure of Deep-Ultraviolet Light-Emitting Diodes to Enhance the Light-Extraction Efficiency, Crystals, 9, 4, 2019. Crossref
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Mousavi Ajarostaghi Seyed Soheil, Zaboli Mohammad, Javadi Hossein, Badenes Borja, Urchueguia Javier F., A Review of Recent Passive Heat Transfer Enhancement Methods, Energies, 15, 3, 2022. Crossref
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Liang Shenghua, Sun Wenhong, Recent Advances in Packaging Technologies of AlGaN‐Based Deep Ultraviolet Light‐Emitting Diodes, Advanced Materials Technologies, 7, 8, 2022. Crossref
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Hammoodi Karrar A., Hasan Hadeel Ali, Abed Muntadher H., Basem Ali, Al-Tajer Ammar M., Control of heat transfer in circular channels using oblique triangular ribs, Results in Engineering, 15, 2022. Crossref
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Hsu Yu-Hsuan, Peng Kang-Wei, Lin Yi-Hsin, Tseng Ming-Chun, Lin Su-Hui, Shen Meng-Chun, Wu Ting-Zhu, Chen Zhong, Horng Ray-Hua, Study on the performance of high-voltage deep ultraviolet light-emitting diodes, Optics Express, 30, 23, 2022. Crossref