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Atomization and Sprays

Published 12 issues per year

ISSN Print: 1044-5110

ISSN Online: 1936-2684

The Impact Factor measures the average number of citations received in a particular year by papers published in the journal during the two preceding years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) IF: 1.2 To calculate the five year Impact Factor, citations are counted in 2017 to the previous five years and divided by the source items published in the previous five years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) 5-Year IF: 1.8 The Immediacy Index is the average number of times an article is cited in the year it is published. The journal Immediacy Index indicates how quickly articles in a journal are cited. Immediacy Index: 0.3 The Eigenfactor score, developed by Jevin West and Carl Bergstrom at the University of Washington, is a rating of the total importance of a scientific journal. Journals are rated according to the number of incoming citations, with citations from highly ranked journals weighted to make a larger contribution to the eigenfactor than those from poorly ranked journals. Eigenfactor: 0.00095 The Journal Citation Indicator (JCI) is a single measurement of the field-normalized citation impact of journals in the Web of Science Core Collection across disciplines. The key words here are that the metric is normalized and cross-disciplinary. JCI: 0.28 SJR: 0.341 SNIP: 0.536 CiteScore™:: 1.9 H-Index: 57

Indexed in

PRODUCTION OF HIGHLY UNIFORM SOLDER SPHERES USING A DIGITAL INTEGRAL CONTROL SCHEME

Volume 9, Issue 6, 1999, pp. 601-621
DOI: 10.1615/AtomizSpr.v9.i6.30
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ABSTRACT

The uniform droplet spray (UDS) process produces solder spheres by controlling the breakup of a continuous laminar jet into uniform droplets, which are then rapidly solidified in a liquid bath or an inert gas. Although the spheres have a narrow size distribution (±9% from mean size), still greater size accuracy is required (±3% from mean size) for the use of these spheres by the electronics industry, particularly for ball grid array (BGA) chip interconnection technology. This article discusses the production of highly size-accurate solder microspheres (75−1000 μm in diameter) by the UDS process. An on-line droplet size control system was developed to achieve the size distribution requirements. Droplet size control is accomplished by performing a real-time measurement of the droplet size, and then compensating for the difference between actual and target sizes by adjusting the breakup frequency. The control system is effective in controlling sphere size, enabling the UDS process to accurately determine and control solder sphere size within ±2.5% of the target size. While this article focuses on the production of large solder spheres (250−800 μm), the control system can be applied to spheres of any size produced by the controlled breakup of a liquid jet.

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