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High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
ESCI SJR: 0.176 SNIP: 0.48 CiteScore™: 1.3

ISSN Print: 1093-3611
ISSN Online: 1940-4360

High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes

DOI: 10.1615/HighTempMatProc.v14.i3.70
pages 285-294

COMPOSITION OF A THERMAL PLASMA FORMED FROM PTFE WITH COPPER IN NON-OXIDANT ATMOSPHERE, PART I: DEFINITION OF A TEST CASE WITH THE SF6

P. Andre
Laboratoire Arc Electrique et Plasmas Thermiques CNRS FRE 3120, Phys. Bât. 5 - Université Blaise Pascal, Aubière Cedex, France; and P.R.E.S. Clermont Université, Clermont-Ferrand Cedex 1, France
Z. Koalaga
LAME,Ouagadougou University, 03 BP7021, Ouagadougou, Burkina Faso

ABSTRACT

The aim of this paper is to draw the main characteristic from theoretical calculations of a good dielectric gas. The SF6 is widely used in the electrical industry for its dielectric and insulating properties. In the purpose to define available parameters, we study the molar fractions of chemical species in PTFE, SF6, Cu mixture for several proportions and pressures. We show that the carbon solid formation and condensed copper formation depends on the SF6 proportions and the presence of the electronegative ions F.


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