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Heat Pipe Science and Technology, An International Journal

ISSN Print: 2151-7975
ISSN Online: 2151-7991

Archives: Volume 1, 2010 to Volume 8, 2017

Heat Pipe Science and Technology, An International Journal

DOI: 10.1615/HeatPipeScieTech.v5.i1-4.610
pages 531-537

APPLICATION OF FLAT PLATE HEAT PIPE FOR COOLING SPACECRAFT ELECTRONICS

D. R. Veeresha
Thermal Systems Group, ISRO Satellite Centre, Indian Space Research Organization P.O. Box 1795, Vimanapura Post, HAL Airport Road, Bangalore - 560017
Ch. SimhachalaRao
Thermal Systems Group, ISRO Satellite Centre, Indian Space Research Organization P.O. Box 1795, Vimanapura Post, HAL Airport Road, Bangalore - 560017
M. K. Shailandran
Thermal Systems Group, ISRO Satellite Centre, Indian Space Research Organization P.O. Box 1795, Vimanapura Post, HAL Airport Road, Bangalore - 560017
S. G. Barve
Thermal Systems Group, ISRO Satellite Centre, Indian Space Research Organization P.O. Box 1795, Vimanapura Post, HAL Airport Road, Bangalore - 560017
D. Kumar
Thermal Systems Group, ISRO Satellite Centre, Indian Space Research Organization P.O. Box 1795, Vimanapura Post, HAL Airport Road, Bangalore - 560017
A. K. Sharma
Thermal Systems Group, ISRO Satellite Centre, Indian Space Research Organization P.O. Box 1795, Vimanapura Post, HAL Airport Road, Bangalore - 560017

ABSTRACT

Spacecraft electronics is the source of heat generation and requires proper dispersion over the base plate/deck or on the radiator surface. In most of the remote sensing spacecraft the electronics operation is intermittent and variation of heat flux needs to be absorbed first, and then transferred to the radiators. The communication spacecraft can experience continuous thermal dissipations and there is a requirement of heat spreading on the radiator over the panel. At internal to the package, there is requirements for cooling the components with high packing densities like processors, ICs (heat flux of around 2 W/cm2) etc.
The flat plate heat pipes (FHP) are recent advancements that are developed for thermal management of issues explained above. In this paper, a methodology adopted for addressing the thermal issues related to electronic packages using the FHP is discussed. Temperature uniformity requirement for the packages, heat transfer capability, etc., are driving this study. The externally mounted electronic package with heat generation, and a component level thermal management issues are taken as examples. A generic concepts specific to these issues and their thermal simulation studies are carried-out.


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