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Heat Pipe Science and Technology, An International Journal

ISSN Print: 2151-7975
ISSN Online: 2151-7991

Archives: Volume 1, 2010 to Volume 8, 2017

Heat Pipe Science and Technology, An International Journal

DOI: 10.1615/HeatPipeScieTech.v5.i1-4.130
pages 145-152

POLYMER FLAT LOOP THERMOSYPHONS

Leonid P. Grakovich
Luikov Heat and Mass Transfer Institute, National Academy of Sciences of Belarus, P. Brovka 15, 220072, Minsk, Belarus
Mikhail I. Rabetskii
Laboratory of Porous Media, A.V.Luikov Heat and Mass Transfer Institute, National Academy of Sciences, P.Brovka 15, 220072, Minsk, Belarus
Leonard L. Vasiliev
Porous Media Laboratory Luikov Heat and Mass Transfer Institute, National Academy of Sciences of Belarus 15, Str. P.Brovka, 220072 Minsk, Belarus
Leonid L. Vasiliev, Jr.
Byelorussian Academy of Sciences; and Luikov Heat & Mass Transfer Institute, Porous Media Laboratory, P. Brovka Str. 15, 220072 Minsk, Belarus
S. P. Bogdanovich
V.A. Belyi Metal Polymer Research Institute of National Academy of Sciences of Belarus, Kirov St. 32A, 246050 Gomel, Belarus
S. S. Pesetskii
V.A. Belyi Metal Polymer Research Institute of National Academy of Sciences of Belarus, Kirov St. 32A, 246050 Gomel, Belarus

ABSTRACT

Heat dissipation necessity becomes an extremely important issue for electronics production, air-conditioning, LED cooling systems and refrigeration. The technology was developed to produce new loop polymer thermosyphons capable of long-term operation without permeation by air or working fluids through their walls. Suggested composite polymer materials with high thermal conductivity are employed as the case material and give possibilities to design a wide range of new heat transfer equipment. In this paper the flat horizontal polymer loop thermosyphon with flexible transport lines is suggested and experimentally tested. Its evaporator and condenser are reinforced with nano carbon filaments and nano particles to improve its thermal conductivity, durability and wettability. The rectangular capillary grooves inside the evaporator and condenser are used as a mean for the heat transfer enhancement. The working fluid is R 600. Thin film evaporation heat transfer for low heat load and two phase flow (vapor bubbles and liquid slugs) heat transfer for high heat load inside the evaporator are inherent for such thermosyphon.


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