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Heat Pipe Science and Technology, An International Journal

ISSN Print: 2151-7975
ISSN Online: 2151-7991

Archives: Volume 1, 2010 to Volume 8, 2017

Heat Pipe Science and Technology, An International Journal

DOI: 10.1615/HeatPipeScieTech.v5.i1-4.220
pages 213-220

THERMAL NETWORK MODEL FOR DEVICE IN FLAT HEAT PIPE ASSISTED HEAT SINK

S. Kesav Kumar
Delphi Automotive PLC, Technical Center India, Bangalore, India
S. N. Sridhara
K S School of Engineering and Management, Bangalore, India

ABSTRACT

Heat pipes are found widespread use in electronics cooling applications. With chip-level heat fluxes reaching 75−100W/cm2, heat pipes provide an attractive passive alternative for use as heat spreaders and to transport heat to remote heat sinks for dissipation. A lot of work has been done on analytical and numerical solutions for the thermal transport in heat pipes, but challenges still remain in devising stable and convergent numerical schemes. The aim of this work is to arrive at a thermal network approach to get an estimate of peak temperature of device mounted on flat heat pipe/vapor chamber assisted heat sink. The flat heat pipe studied has wick and an integrated heat sink. In the wick region, the thermal contours will be highly two dimensional. To account for this, a correction in area is suggested while calculating the wick thermal resistance. The heat sink effects are accounted in the form of suitable effective heat transfer coefficient. The network model developed is validated against numerical model simulated using FloTHERMTM. The network model founds to be working well for varying power densities when heat sink cross section normal to direction of heat flow matches with that of vapor chamber.


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