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Heat Pipe Science and Technology, An International Journal

ISSN Print: 2151-7975
ISSN Online: 2151-7991

Archives: Volume 1, 2010 to Volume 8, 2017

Heat Pipe Science and Technology, An International Journal

DOI: 10.1615/HeatPipeScieTech.v5.i1-4.110
pages 129-136

DEVELOPMENT OF ALUMINUM-WATER HEAT PIPES

Masahiro Kuroda
Intel Corporation, 2200 Mission College Blvd, Santa Clara, CA 95054, USA
Je-Young Chang
Intel Corporation, 2200 Mission College Blvd, Santa Clara, CA 95054, USA
Paul Gwin
Intel Corporation, 2200 Mission College Blvd, Santa Clara, CA 95054, USA
Rajiv Mongia
Intel Corporation, 2200 Mission College Blvd, Santa Clara, CA 95054, USA
Choong-Un Kim
University of Texas at Arlington, 501 West First Street, Arlington, TX 76019, USA
Gerald P. Cabusao
Fujikura Ltd., 1-5-1, Kiba Koto-ku, Tokyo 135-8512, Japan
Kazuhiko Goto
Fujikura Ltd., 1-5-1, Kiba Koto-ku, Tokyo 135-8512, Japan
Masataka Mochizuki
Thermal Technology Division, Fujikura Ltd. 1-5-1, Kiba, Koto-Ku, Tokyo 135, Japan

ABSTRACT

A common type of heat pipe used for computer cooling applications has been copper as a fluid container and water as a working fluid. The nature of copper such as high mass and material cost, however, has spurred considerable interest on aluminum as a potential replacement while aluminum-water combination is subject to corrosion reaction. In this paper, we present the technology development results attempted to enable the aluminum-water heat pipes. We studied an approach of providing thermodynamic compatibility between the aluminum surface and water by a formation of a defect-free hydration layer on top of the aluminum surface. Our trial of this technique applied to non-wick aluminum heat pipe samples revealed that the non-condensable gas generation can be effectively suppressed by the new coating structure evidenced by continuous working of heat pipe after a high temperature reliability testing of more than 300 hours at 130 °C. We also applied the same technique to wicked aluminum pipes and evaluated heat carrying capacity and thermal resistance.


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