Library Subscription: Guest
Begell Digital Portal Begell Digital Library eBooks Journals References & Proceedings Research Collections
Heat Transfer Research
IF: 1.199 5-Year IF: 1.155 SJR: 0.267 SNIP: 0.503 CiteScore™: 1.4

ISSN Print: 1064-2285
ISSN Online: 2162-6561

Volume 51, 2020 Volume 50, 2019 Volume 49, 2018 Volume 48, 2017 Volume 47, 2016 Volume 46, 2015 Volume 45, 2014 Volume 44, 2013 Volume 43, 2012 Volume 42, 2011 Volume 41, 2010 Volume 40, 2009 Volume 39, 2008 Volume 38, 2007 Volume 37, 2006 Volume 36, 2005 Volume 35, 2004 Volume 34, 2003 Volume 33, 2002 Volume 32, 2001 Volume 31, 2000 Volume 30, 1999 Volume 29, 1998 Volume 28, 1997

Heat Transfer Research

DOI: 10.1615/HeatTransRes.v40.i8.10
pages 717-727

Incremental Heat Conduction Versus Mass Reduction in Large Corrugated Walls Derived from a Large Plane Wall

Antonio Campo
Department of Mechanical Engineering, The University of Texas at San Antonio, San Antonio, Texas 78249, USA
Justin E. Robbins
Department of Mechanical Engineering, The University of Vermont, Burlington, VT 05405, USA


A conventional large plane wall of thickness H is equivalent to a cluster of stackable square modules of side H with a hot left side, a cold right side, and insulated top and bottom sides (or planes of symmetry). When the two vertical sides of a primary square module are bent inward symmetrically, various kinds of scalloped modules (inscribed in the square module) could be formed depending upon the levels of curvature. Correspondingly, a collection of large corrugated walls can be built consisting of stackable scalloped modules. The heat conduction across any secondary scalloped module is intrinsically two-dimensional, in contrast to the heat conduction across a primary square module that is one-dimensional. As a "proof-of-concept", the governing heat conduction equation in two dimensions is solved numerically with the Finite Element Method under the COMSOL platform for three pre-selected derived modules with different degrees of scallopness. The heat conduction enhancement of the three scalloped modules is contrasted against the basic square module, taking into account concurrently the beneficial mass reduction.


  1. P. J. Schneider, Conduction Heat Transfer.

  2. H. S. Carslaw and J. Ñ Jaeger, Conduction of Heat in Solids.

  3. V. Arpaci, Conduction Heat Transfer.

  4. A. V. Luikov, Analytical Heat Diffusion Theory.

  5. G. E. Myers, Analytical Methods in Conduction Heat Transfer.

  6. U. Grigull and H. Sanders, Heat Conduction.

  7. S. Kakac and Y. Yener, Heat Conduction.

  8. M. N. Ozisik, Heat Conduction.

  9. D. Poulikakos, Conduction Heat Transfer.

  10. J. Taler and P. Duda, Solving Direct and Inverse Heat Conduction Problems.

  11. J. E. Sunderland and K. R. Johnson, Shape factors for heat conduction through bodies with isothermal boundaries.

  12. E. Hahne and U. Grigull, Formfaktor und Formwiderstand der stationaren mehrdimensionalen Warmeleitung.

  13. ASHRAE Handbook of Fundamentals.

  14. D. W. Pepper and J. C. Heinrich, The Finite Element Method: Concepts and Applications.

  15. I. Langmuir, E. Q. Adams, and G. S. Meikle, Flow of heat through furnace walls: the shape factor.

Articles with similar content:

Extension of the Method of Cross Sections to the Problem of Wave Propagation in an Elastic Layer with Smoothly Varying Parameters
International Journal of Fluid Mechanics Research, Vol.26, 1999, issue 5-6
B. V. Galanenko
Special Topics & Reviews in Porous Media: An International Journal, Vol.6, 2015, issue 2
Terrence W. Simon, Perry Y. Li, Chao Zhang, James D. Van de Ven
International Heat Transfer Conference 7, Vol.2, 1982, issue
Richard N. Smith, James D. Koch
Slot Array as a Coupling Element for Quasi-Optical Resonator with a Single-Mode Rectangular Waveguide
Telecommunications and Radio Engineering, Vol.55, 2001, issue 3
V. A. Karpovich, V. N. Rodionova, G. Ya. Slepyan
Numerical Modeling of Three Dimensional Heat Transfer and Fluid Flow Through Interrupted Plates Using Unit Cell Scale
International Heat Transfer Conference 15, Vol.40, 2014, issue
Terrence W. Simon, Perry Y. Li, Chao Zhang, James D. Van de Ven