Visualization of Mechanical Processes: An International Online Journal
Flow and Heat Transfer around Finned-Heat Sink in Electronic Enclosure with Axial Cooling Fan
Mechanical Systems Engineering, Toyama Prefectural University, 5180 Kurokawa, Imizu, Toyama 939-0398, Japan
Kanazawa Institute of Technology, 7-1 Ohgigaoka, Nonoichi, Ishikawa 921-8501, Japan
Toyama Prefectural University, 5180 Kurokawa, Imizu, Toyama 939-0398, Japan
Toyama Prefectural University; Department of Mechanical Engineering, Aoyama Gakuin University,
6-16-1 Chitosedai, Setagaya, Tokyo 157-8572, Japan
Cosel Co., Ltd., 1-6-43 Kamiakae-Machi, Toyama, 930-0816, Japan
Toyama Prefectural University
This study describes effects of cooling fans on flow and heat transfer characteristics in electronic equipment. We especially focus on flow and heat transfer performance in a narrow duct which simulates a tight flow pass in thin electronic systems and includes a fan and a finned heat sink. To investigate effects of a flow generated by a fan, flow visualization in the duct and thermal resistance measurement of the heat sink mounted in the duct are performed. We compared the results of the experiment in the case of the fan flow with those of the straightened flow. From the results, it is found that a prerotation flow around the fan causes swirl and turbulence in the duct flow and this affects heat transfer performance of the heat sink. This may be one factor in an incorrect prediction of forced convection cooling driven by a fan.
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