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International Journal for Multiscale Computational Engineering

Publication de 6  numéros par an

ISSN Imprimer: 1543-1649

ISSN En ligne: 1940-4352

The Impact Factor measures the average number of citations received in a particular year by papers published in the journal during the two preceding years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) IF: 1.4 To calculate the five year Impact Factor, citations are counted in 2017 to the previous five years and divided by the source items published in the previous five years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) 5-Year IF: 1.3 The Immediacy Index is the average number of times an article is cited in the year it is published. The journal Immediacy Index indicates how quickly articles in a journal are cited. Immediacy Index: 2.2 The Eigenfactor score, developed by Jevin West and Carl Bergstrom at the University of Washington, is a rating of the total importance of a scientific journal. Journals are rated according to the number of incoming citations, with citations from highly ranked journals weighted to make a larger contribution to the eigenfactor than those from poorly ranked journals. Eigenfactor: 0.00034 The Journal Citation Indicator (JCI) is a single measurement of the field-normalized citation impact of journals in the Web of Science Core Collection across disciplines. The key words here are that the metric is normalized and cross-disciplinary. JCI: 0.46 SJR: 0.333 SNIP: 0.606 CiteScore™:: 3.1 H-Index: 31

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A TWO-SCALE APPROACH FOR THE DROP SHOCK SIMULATION OF A PRINTED CIRCUIT BOARD PACKAGE CONSIDERING REFLOWED SOLDER BALL GEOMETRIES

Volume 18, Numéro 4, 2020, pp. 455-476
DOI: 10.1615/IntJMultCompEng.2020035631
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RÉSUMÉ

In this paper, we introduce a new computational approach for linking the information of mesoscale solder ball shapes to the macroscale drop test of a printed circuit board. The approach starts with a numerical prediction of mesoscale solder bump profiles using a novel full-implicit Lagrangian particle method to approximate the Navier-Stokes equations and efficiently simulate the incompressible free surface reflow soldering process. The surface tension of the molten solder and the wall adhesion between the solder and the substrate are considered in the simulation. Subsequently, the predicted solder ball shapes from the reflow analysis are used in a chip package model for the drop shock analysis. The mesoscale solder joint model is coupled concurrently with the macroscale chip package model using the co-simulation to achieve the nonintrusive scale-bridging effect. To attend practical explicit-explicit two-scale co-simulations, an algorithm that handles properly the load-balancing, heterogeneity of processors, and memory also has been developed. We present four numerical examples that showcase the effectiveness of the new approach.

RÉFÉRENCES
  1. Ahmed, N. and Xue, P., Determination of the Size of the Local Region for Efficient Global/Local Modeling in a Large Composite Structure under Impact Loading, Int. J. Impact Eng., in press, 2020. DOI: 10.1016/j.ijimpeng.2020.103646.

  2. Amalu, E.H. and Ekere,N.N., High Temperature Reliability of Lead-Free Solder Joints in a Flip Chip Assembly, J. Mater. Process. Tech., vol. 212, pp. 471-483, 2012.

  3. Asai, M., Aly, A.M., Sonoda, Y., and Sakai, Y., A Stabilized Incompressible SPH Method by Relaxing the Density Invariance Condition, J. Appl. Math, vol. 2012, p. 139583, 2012.

  4. Belytschko, T., Yen, H.J., and Mullen, R., Mixed Methods for Time Integration, Comput. Methods Appl. Mech. Eng., vols. 17-18, pp. 259-275, 1979.

  5. Bettinotti, O., Allix, O., Perego, U., Oancea, V., andMalherbe, B., Simulation ofDelamination under Impact Using a Global-Local Method in Explicit Dynamics, Finite Elem. Anal. Des., vol. 125, pp. 1-13,2017.

  6. Boucard, P.A., Odievre, D., and Gatuingt, F., A Parallel and Multiscale Strategy for the Parametric Study of Transient Dynamic Problems with Friction, Int. J. Numer. Methods Eng., vol. 88, pp. 657-672,2011.

  7. Brakke, K.A., The Surface Evolver and the Stability of Liquid Surface, Philos. Trans. R. Soc. London, Ser. A, vol. 354, pp. 2143-2157,1996.

  8. Chiang, K.N., Lin, Y.T., and Cheng, H.C., On Enhancing Eutectic Solder Joint Reliability Using a Second-Reflow Process Approach, IEEE Trans. Adv. Packag., vol. 23, no. 1, pp. 9-14, 2000.

  9. Chiang, K.N. and Yuan, C.A., An Overview of Solder Bump Shape Prediction Algorithms with Validations, IEEE Trans. Adv. Packag, vol. 24, no. 2, pp. 158-162, 2001.

  10. Chong, D.Y.R., Che, F.X., Pang, J.H.L., Ng, K., Tan, J.Y.N., and Low, P.T.H., Drop Impact Reliability Testing for Lead-Free and Lead-Based Soldered IC Packages, Microelectron. Reliab., vol. 46, pp. 1160-1171,2006.

  11. Chou, Y. Y., Chang, H.J., Kuo, J.H., and Hwang, W.S., The Simulation of Shape Evolution of Solder Joints during Reflow Process and Its Experimental Validation, Mater. Trans, vol. 47, no. 4, pp. 1186-1192,2006.

  12. Dehning, C., Bierwisch, C., and Kraft, T., Co-Simulations of Discrete and Finite Element Codes, in M. Griebel and M. Schweitzer, Eds., Meshfree Methods for Partial Differential Equations VII, Lecture Notes in Computational Science and Engineering, vol. 100, Cham, Switzerland: Springer, 2015.

  13. Dhia, H.B. and Rateau, G., The Arlequin Method as a Flexible Engineering Design Tool, Int. J. Numer. Methods Eng., vol. 62, pp. 1442-1462, 2005.

  14. Dhiman, H.S., Fan, X., and Zhou, T., Modeling Techniques for Board Level Drop Test for a Wafer-Level Package, Int. Conf. Electronic Packaging Technology and High Density Packaging, 2008.

  15. Gendre, L., Allix, O., Gosselet, P., and Comte, F., Non-Intrusive and Exact Global/Local Techniques for Structural Problems with Local Plasticity, Comput. Mech., vol. 44, pp. 233-245, 2009.

  16. Grovenor, C.R.M., Microelectronic Materials, New York: Taylor & Francis Group, 2017.

  17. Guermond, J.L., Minev, P., and Shen, J., An Overview of Projection Methods for Incompressible Flows, Comput. Methods Appl. Mech. Eng., vol. 195, pp. 6011-6045,2006.

  18. Idelsohn, S.R., Ornte, E., and Del Pin, F., The Particle Finite Element Method: A Powerful Tool to Solve Incompressible Flows with Free-Surfaces and Breaking Waves, Int. J. Numer. Methods Eng., vol. 61, pp. 964-989, 2004.

  19. JEDEC Solid State Technology Association, Board Level Drop Test Method of Components for Handheld Electronic Products, JEDEC Standard JESD22-B111, 2003.

  20. Heinrich, S.M., Schaefer, M., Schroeder, S.A., and Lee, P.S., Prediction of Solder Joint Geometries in Array-Type Interconnects, ASMEJ. Electron. Packag., vol. 118, pp. 114-121, 1996.

  21. Kok, C.K., Ng, W.J., Ooi, C.C., and Liew, K.W., Ball-Grid-Array Solder Joint Model for Assembly-Level Impact Reliability Prediction, Microelectron. Reliab., vol. 65, pp. 184-191, 2016.

  22. Koshizuka, S. and Oka, Y., Moving-Particle Semi-Implicit Method for Fragmentation of Incompressible Fluid, Nucl. Sci. Eng., vol. 123, pp. 421-434, 1996.

  23. Ma, H. and Lee, T.K., Effects of Board Design Variations on the Reliability of Lead-Free Solder Joints, IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 1, pp. 71-78, 2013.

  24. Pan, X., Wu, C.T., Hu, W., and Wu, Y., A Momentum-Consistent Stabilization Algorithm for Lagrangian Particle Methods in the Thermo-Mechanical Friction Drilling Analysis, Comput. Mech, vol. 64, pp. 625-644,2019.

  25. Pan, X., Wu, C.T., and Hu, W., A Semi-Implicit Stabilized Particle Galerkin Method for Incompressible Free Surface Simulations, Int. J. Numer. Methods Eng., vol. 121, no. 17, pp. 3979-4002,2020.

  26. Rayasam, M., Subbarayan, T.B., Gurumurthy, C., and Wilcox, J.R., A Model for Assessing the Shape of Solder Joints in the Presence of PCB and Package Warpage, ASMEJ. Electron. Packag, vol. 128, pp. 184-191, 2006.

  27. Rodrigues, N., Ferreira, A.C., Teixeria, S.F., Soares, D., Teixeria, J.C., Cerqueira, F., andMacedo, F., Contact Angle Measurement of SAC 305 Solder: Numerical and Experimental Approach, J Mater. Sci.: Mater. Electron., vol. 27, pp. 8941-8950,2016.

  28. Sun, W., Fish, J., and Zhang, G., Superposition ofNon-Ordinary State-Based Peridynamics and Finite Element Method for Material Failure Simulations, Meccanica, vol. 55, pp. 681-699,2020.

  29. Syed, A., Kim, S.M., Lin, W., Khim, J.Y., Song, E.S., Shin, J.H., and Panczak, T., A Methodology for Drop Performance Prediction and Application for Design Optimization of Chip Scale Packages, Electronic Components Technol. Conf, 2005.

  30. Tamin, M.N. and Shaffiar, N.M., Solder Joint Reliability Assessment: Finite Element Simulation Methodology, Cham, Switzerland: Springer, 2014.

  31. Wu, C.T., Wu, Y., Crawford, J.E., and Magallanes, J.M., Three-Dimensional Concrete Impact and Penetration Simulations Using the Smoothed Particle Galerkin Method, Int. J. Impact Eng., vol. 106, pp. 1-17, 2017.

  32. Wu, C . T. , Bui, T. Q . , Wu, Y. , Luo, T.L. , Wang, M. , Liao, C . C . , Chen, P. Y. , and Lai, Y. S . , Numerical and Experimental Validation of a Particle Galerkin Method for Metal Grinding Simulation, Comp. Mech., vol. 61, pp. 365-383,2018.

  33. Wu, C.T., Wu, Y., Lyu, D., Pan, X., and Hu, W., The Momentum-Consistent Smoothed Particle Galerkin (MC-SPG) Method for Simulating the Extreme Thread Forming in the Follow Drill Screw-Driving Process, Comp. Part. Mech., vol. 7, pp. 177-191, 2020.

  34. Xia, W., Xiao, M., Chen, Y., and Wu, F., Thermal Warpage Analysis of PBGA Mounted on PCB during Reflow Process by FEM and Experimental Measurement, Solder. Surf. Mt. Tech., vol. 26, pp. 162-171, 2014.

  35. Yeung, B.H. and Lee, T.T., Evaluation and Optimization of Package Processing and Design through Solder Joint Profile Prediction, IEEE Trans. Adv. Packag., vol. 26, no. 1, pp. 68-74, 2003.

  36. Yu, D., Kwak, J., Park, S., Chung, S., and Yoon, J.Y., Effect of Shield-Can on Dynamic Response of Board-Level Assembly, ASME J. Electron. Packag, vol. 134, p. 031010,2012.

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