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Volumen 9, 1998

Tabla de Contenidos
DOI: 10.1615/AnnualRevHeatTransfer.v9
ISBN: 1-56700-087-8 (Print)
ISBN: 978-1-56700-087-0 (Print)
ISBN: 978-1-56700-331-4 (Online)
ISSN: 1049-0787




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Illustration of composite TIMs with a percolation of spherical nanoparticles, and high aspect ratio nanowires. NANOSTRUCTURED THERMAL INTERFACES
Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
The microchannel with a single pillar used by Jung et al., and an SEM image of the pillar with a flow control slit at 180 deg (facing downstream). ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Schematics of thermal boundary conductance calculations. NONEQUILIRIUM MOLECULAR DYNAMICS METHODS FOR LATTICE HEAT CONDUCTION CALCULATIONS