%0 Journal Article %A Zhang, Wen-Hua %A Lin, Wei-Keng %A Yeh, Chih-Ting %A Chiang, Song-Bor %A Jao, Chih-Sheng %D 2019 %I Begell House %K liquid-packaging, UV LED, silicon oil, thermal resistance, heat dissipation %N 4 %P 349-360 %R 10.1615/HeatTransRes.2018025129 %T A NOVEL LIQUID-PACKAGING TECHNOLOGY FOR HIGHLY RELIABLE UV-LED ENCAPSULATION %U https://www.dl.begellhouse.com/journals/46784ef93dddff27,069137575e3e0439,56f910ef6abd8b87.html %V 50 %X This paper proposes a liquid-packaging technology for UV LED. Unlike the traditional packaging methods that involve thermosett ing silicon or quartz glass, the proposed method primarily uses silicon oil to directly contact the chip, which prevents erosion due to moisture or oxygen. In this study, UV LEDs with high heat dissipation technology were selected, and the experimental results of optical and thermal management were compared between the general packaging and liquid-packaging structures, respectively. The results of the optical experiments showed that the proposed method increases the extraction effi ciency by 9.5%. The results of the heat dissipation experiments showed that the liquid-packaging technology can reduce the thermal resistance of the UV-LED package by 31%. %8 2018-12-12