Suscripción a Biblioteca: Guest
Portal Digitalde Biblioteca Digital eLibros Revistas Referencias y Libros de Ponencias Colecciones
International Journal of Fluid Mechanics Research
ESCI SJR: 0.206 SNIP: 0.446 CiteScore™: 0.5

ISSN Imprimir: 2152-5102
ISSN En Línea: 2152-5110

Volumes:
Volumen 46, 2019 Volumen 45, 2018 Volumen 44, 2017 Volumen 43, 2016 Volumen 42, 2015 Volumen 41, 2014 Volumen 40, 2013 Volumen 39, 2012 Volumen 38, 2011 Volumen 37, 2010 Volumen 36, 2009 Volumen 35, 2008 Volumen 34, 2007 Volumen 33, 2006 Volumen 32, 2005 Volumen 31, 2004 Volumen 30, 2003 Volumen 29, 2002 Volumen 28, 2001 Volumen 27, 2000 Volumen 26, 1999 Volumen 25, 1998 Volumen 24, 1997 Volumen 23, 1996 Volumen 22, 1995

International Journal of Fluid Mechanics Research

DOI: 10.1615/InterJFluidMechRes.v29.i2.20
12 pages

Heat Transfer in a Thin Liquid Film in the Presence of Electric Field for Non-Isothermal Interfacial Condition

Rama Subba Reddy Gorla
Department of Mechanical Engineering, Cleveland State University, Cleveland, OH, 44115 USA; Department of Mechanical Engineering, University of Akron, Akron, Ohio 44325, USA; Department of Mechanical & Civil Engineering, Purdue University Northwest, Westville, IN 46391, USA
Jorge E. Gatica
Department of Chemical Engineering Cleveland State University Cleveland, OH 44115, USA
Bahman Ghorashi
Department of Chemical & Biomedical Engineering, Cleveland State University, Cleveland, Ohio 44115-2425
Pijarn In-Eure
Department of Chemical Engineering Cleveland State University Cleveland, OH 44115, USA
Larry W. Byrd
Thermal Structures Branch, Air Vehicles Directorate, Air Force Research Laboratory, Wright Patterson Air Force Base, OH 45433, USA

SINOPSIS

Heat transfer enhancement in an evaporating thin liquid film using the electric field under non-isothermal interfacial condition is presented. A new mathematical model subjected to van der Waals attractive forces, the capillary pressure and the electric field is developed to describe the heat transfer enhancement in the evaporating thin liquid film. The effect of an electrostatic field on the curvature of the thin film, evaporative flux, pressure gradient distribution, heat flux, and heat transfer coefficient in the thin film is presented. The results show that the electric field can enhance heat transfer in the thin liquid film significantly. In addition, using electric fields on the evaporating film will be a way to expand the extended meniscus region to attain high heat transfer coefficients and high rates of heat flux.


Articles with similar content:

Film Condensation on Finned Surfaces with Suction under Space Conditions
Heat Transfer Research, Vol.29, 1998, issue 1-3
V. N. Buz, Henry F. Smirnov
THERMAL CAPILLARY EFFECT ON THIN FILM EVAPORATION
International Heat Transfer Conference 16, Vol.4, 2018, issue
Benwei Fu, Hongbin Ma, Xu Jiujun, Nannan Zhao, Bohan Tian
EFFECT OF ELECTROHYDRODYNAMICS IN SATURATED FILM BOILING WITH VARYING SUPERHEAT
ICHMT DIGITAL LIBRARY ONLINE, Vol.0, 2015, issue
Vinod Pandey, Ganesh Natarajan , Gautam Biswas, Amaresh Dalal
SUPERCOOLING BY EVAPORATION OF AN EXTRA THIN FILM MAINTAINED BY MICRO DROPLET DEPOSITION
International Heat Transfer Conference 9, Vol.4, 1990, issue
I. Issapour, S.K. Cho, S.L. Lee, Z.H. Yang
Evaporation Heat Transfer of Thin Liquid Film and Meniscus in Micro Capillary and on Substrate with Nanorelief
Journal of Enhanced Heat Transfer, Vol.10, 2003, issue 2
Lichun Zhang, Tongze Ma, Xinshi Ge, Wei Qu