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International Journal for Multiscale Computational Engineering

Publicado 6 números por año

ISSN Imprimir: 1543-1649

ISSN En Línea: 1940-4352

The Impact Factor measures the average number of citations received in a particular year by papers published in the journal during the two preceding years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) IF: 1.4 To calculate the five year Impact Factor, citations are counted in 2017 to the previous five years and divided by the source items published in the previous five years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) 5-Year IF: 1.3 The Immediacy Index is the average number of times an article is cited in the year it is published. The journal Immediacy Index indicates how quickly articles in a journal are cited. Immediacy Index: 2.2 The Eigenfactor score, developed by Jevin West and Carl Bergstrom at the University of Washington, is a rating of the total importance of a scientific journal. Journals are rated according to the number of incoming citations, with citations from highly ranked journals weighted to make a larger contribution to the eigenfactor than those from poorly ranked journals. Eigenfactor: 0.00034 The Journal Citation Indicator (JCI) is a single measurement of the field-normalized citation impact of journals in the Web of Science Core Collection across disciplines. The key words here are that the metric is normalized and cross-disciplinary. JCI: 0.46 SJR: 0.333 SNIP: 0.606 CiteScore™:: 3.1 H-Index: 31

Indexed in

INVESTIGATION ON INTERFACIAL THERMAL RESISTANCES OF Al/Cu STRUCTURE BY USING HYBRID MODELING WITH MULTISCALE CHARACTERISTICS

Volumen 12, Edición 3, 2014, pp. 211-221
DOI: 10.1615/IntJMultCompEng.2014007937
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SINOPSIS

The size effects of interfacial thermal resistance (ITR), interfacial thermal conductivity (ITC), and interfacial region thickness (IRT) of the metal matching structure are investigated by presenting a multiscale method. In this multiscale method, the interface stress element (ISE) method is set as a coupling button to a span-scale model combined with molecular dynamics (MD) and finite element methods (FEM) by HMD−ISE and HISE−FE handshake regions. The Al/Cu structure simulation can illustrate the validity of this numerical evaluation method considering the wire bonding temperature (300~800 K). The simulation shows that the ITR nonlinear decreases with the increasing of bonding temperature, while the IRT nonlinear increases with the increase of bonding temperature. The ITC nonlinear increases with the increasing of bonding temperature. It indicates that the higher bonding temperature can improve the ITC and IRT of the interface structure. All these are useful for understanding the interfacial properties of wire bonding interface structures. It implies a potential method for design and analysis of the interfacial characteristics in micro-/nanoassembly.

CITADO POR
  1. Yang Ping, Fan Haibiao, Zhang Liqiang, Tang Yunqing, Computation of thermal properties of a copper–copper nano interface structure using a MD–ISE–FE method, International Journal of Heat and Mass Transfer, 78, 2014. Crossref

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