%0 Journal Article %A Esteki, M. H. %A Reizes, John A. %A Behnia, Masud %D 1998 %I Begell House %N 4-6 %P 711-719 %R 10.1615/InterJFluidMechRes.v25.i4-6.230 %T Natural Convection Heat Transfer from Electronic Components Located in an Enclosure %U https://www.dl.begellhouse.com/journals/71cb29ca5b40f8f8,61cf9691751b599d,590c5ad6093ec986.html %V 25 %X The problem of laminar natural convection cooling of electronic components located on a vertical substrate placed in a square enclosure filled with a fluid of Prandtl number equal to 0.71 corresponding to air is studied numerically. A commercially available general purpose CFD code, FLOW3D, was used to simulate the physical problem. Results have been obtained for a number of two dimensional geometries of realistic size conditions. The optional positions for the cooling of isothermal and constant heat flux plates are given. %8 1998-12-01