RT Journal Article ID 42286e6b20d855d3 A1 Menecier, S. A1 Jarrige, J. A1 Labbe, J. C. A1 Lefort, Pierre T1 RELEVANT PARAMETERS FOR LASER BONDING OF COPPER ON ALUMINA JF High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes JO HTM YR 2006 FD 2006-06-01 VO 10 IS 2 SP 281 OP 300 AB A laser process was used to produce copper tracks on alumina substrates. The numerous operating parameters involved made it difficult. In order to determinate the most influent factors among laser power (from 10 to 100 W), laser beam diameter (from 1 to 5 mm), preheating temperature of the substrate (from 200 to 400°C), scanning velocity (from 1 to 100 mrn·s−1), scanning overlap (from 0 to 90%) and copper grain size (three different powders), a Plackett and Burman's design of experiments has been used. With a very limited number of experiments (8), this method allowed to obtain first encouraging results. Indeed adherent copper tracks with an electrical conductivity of 6·104 S·m−1 were obtained. PB Begell House LK https://www.dl.begellhouse.com/journals/57d172397126f956,6bc97cde069281f6,42286e6b20d855d3.html