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High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
ESCI SJR: 0.176 SNIP: 0.48 CiteScore™: 1.3

ISSN Druckformat: 1093-3611
ISSN Online: 1940-4360

High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes

DOI: 10.1615/HighTempMatProc.v10.i2.100
pages 281-300

RELEVANT PARAMETERS FOR LASER BONDING OF COPPER ON ALUMINA

S. Menecier
SPCTS-CNRS UMR 6638, University of Limoges, 123 av. A. Thomas, 87060 Limoges Cedex, France
J. Jarrige
Science des Procedes Ceramiques et de Traitements de Surface (SPCTS), CNRS UMR 6638, Faculte des Sciences de Limoges, 123, av. A. Thomas - 87060 Limoges Cedex, France
J. C. Labbe
Faculte des Sciences et Techniques, L.M.C.T.S. - C.N.R.S. E.S.A. 6015 Universite de Limoges -123, av. Albert Thomas - 87065 LIMOGES Cedex, France
Pierre Lefort
Laboratoire Science des Precedes Ceramiques et Traitements de Surface UMR CNRS 6638 123 Avenue Albert-Thomas F-87060 Limoges Cedex, France

ABSTRAKT

A laser process was used to produce copper tracks on alumina substrates. The numerous operating parameters involved made it difficult. In order to determinate the most influent factors among laser power (from 10 to 100 W), laser beam diameter (from 1 to 5 mm), preheating temperature of the substrate (from 200 to 400°C), scanning velocity (from 1 to 100 mrn·s−1), scanning overlap (from 0 to 90%) and copper grain size (three different powders), a Plackett and Burman's design of experiments has been used. With a very limited number of experiments (8), this method allowed to obtain first encouraging results. Indeed adherent copper tracks with an electrical conductivity of 6·104 S·m−1 were obtained.


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