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High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
ESCI SJR: 0.176 SNIP: 0.48 CiteScore™: 1.3

ISSN Druckformat: 1093-3611
ISSN Online: 1940-4360

High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes

DOI: 10.1615/HighTempMatProc.2016017251
pages 45-57

EFFECT OF THICKNESS ON THE PROPERTIES OF SPUTTERED Ti THIN FILMS ON AA1100 FOR MEMS APPLICATION

S. Venkatesan
Mechanical Engineering, Dr N.G.P. Institute of Technology, Coimbatore, Tamilnadu, India
M. Ramu
Department of Mechanical Engineering, PSG College of Technology, Coimbatore − 641004, Tamil nadu, India

ABSTRAKT

This paper reports the effect of thickness on the properties of titanium (Ti) films deposited on the AA1100 substrate using the DC magnetron sputtering technique. The structural and morphological characterization of Ti films was performed using X-ray diffraction (XRD), energy-dispersive X-ray (EDX), and scanning electron microscopy (SEM). The XRD pattern revealed that the films deposited using DC magnetron sputtering have the HCP symmetry with preferred orientation along the (111) plane for 150 µm thickness at the substrate temperature (673 K). The occurrence of metallic Ti was also confirmed by EDX analysis. SEM images illustrate that the finite-size grains uniformly distributed on the surface exhibit improved hardness, scratch resistance, good adhesion and excellent surface roughness of the film.

SCHLÜSSELWÖRTER: titanium, thin films, sputtering, hardness, MEMS

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