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第13届国际传热学会年报
Graham de Vahl Davis (open in a new tab) School of Mechanical and Manufacturing Engineering, University of New South Wales, Kensington, NSW, Australia
Eddie Leonardi (open in a new tab) Computational Fluid Dynamics Research Laboratory, School of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, Australia 2052

ISSN Online: 2377-424X

ISBN CD: 1-56700-226-9

ISBN Online: 1-56700-225-0

ON-CHIP HOTSPOT THERMAL MANAGEMENT WITH AN EMBEDDED ARRAY OF SILICON THERMOELECTRIC MICROCOOLERS

page 13
DOI: 10.1615/IHTC13.p27.90
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摘要

Driven by shrinking feature sizes, microprocessor hotspots on silicon chips - with their associated high heat flux and sharp temperature gradients - have emerged as the primary "driver" for thermal management of today's IC technology. Solid state thermoelectric microcoolers, fabricated and judiciously distributed on the back surface of the silicon chip, offer great promise for reducing the severity of on-chip hotspots. In this paper the results of a systematic, three-dimensional, numerical thermal-electrical coupled analysis of the temperature field generated by an array of on-chip silicon thermoelectric microcoolers are presented. Attention is focused on the hotspot temperature reductions associated with variations in microcooler number, microcooler sizes, microcooler spacing, chip thickness, silicon doping concentration and the parasitic Joule heating effect from electrical contact resistance. These results suggest that a 3×3 microcooler (70μm×70μm) array on the back surface of silicon chip could remove 80% of the temperature rise produced by a 70μm×70μm hotspot with a heat flux of 680W/cm2.

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