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传热年鉴网络版(1-14卷)

编辑委员会

Gang Chen
Mechanical Engineering Department, Massachusetts Institute of Technology, Cambridge, MA 02139, USA

Zhuomin M. Zhang
Institute of Engineering Thermophysics, Shanghai Jiao Tong University, Shanghai, 200240, China; George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA

Yogesh Jaluria
Department of Mechanical and Aerospace Engineering Rutgers, The State University of New Jersey Piscataway, NJ 08854, USA

Vishwanath Prasad
University of North Texas, USA

ARHT Digital Library

Illustration of composite TIMs with a percolation of spherical nanoparticles, and high aspect ratio nanowires. NANOSTRUCTURED THERMAL INTERFACES
Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
The microchannel with a single pillar used by Jung et al., and an SEM image of the pillar with a flow control slit at 180 deg (facing downstream). ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Schematics of thermal boundary conductance calculations. NONEQUILIRIUM MOLECULAR DYNAMICS METHODS FOR LATTICE HEAT CONDUCTION CALCULATIONS