RT Journal Article ID 67b9552700cab4bd A1 Vinogradov, A. Ya. A1 Andronov, A. N. A1 Ustinov, A. B A1 Orlov, K. E. A1 Smirnov, A. S. T1 LOW TEMPERATURE PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION OF CARBON FILMS ON DIFFERENT SUBSTRATES JF High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes JO HTM YR 2006 FD 2006-12-01 VO 10 IS 3 SP 457 OP 466 AB Polymer and diamond like carbon thin films were deposited at temperature below 250°C by high frequency (40−60 MHz) plasma enhanced chemical vapor deposition. The films have been successfully deposited on metal (Ti, Cu, Mo, Ta, Ni, Pt), silicon, germanium, ceramic, quarts and glass flat substrates as well as on 3-D objects: metal balls, washer, tips, cones. Electron field emission, optical and electrical properties, mechanical and tribological behavior of the films were studied in comparison with their structure, phase and chemical composition. Plasma pre-treatment of the substrate, ion bombardment and etching of growing film surface were found to be the key factors of the film deposition process. PB Begell House LK https://www.dl.begellhouse.com/journals/57d172397126f956,129b3bee3f245137,67b9552700cab4bd.html