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热管科学与技术

每年出版 4 

ISSN 打印: 2151-7975

ISSN 在线: 2151-7991

FEASIBILITY STUDY FOR MEASURING VAPOR CHAMBER THERMAL DIFFUSIVITY BASED ON THE ANGSTROM METHOD

卷 4, 册 1-2, 2013, pp. 133-155
DOI: 10.1615/HeatPipeScieTech.2013008155
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摘要

In this experiment, we applied the Angstrom method in measuring thermal diffusivity. In addition, we also measured the specific heat of thermal conducting material by using a specific heat measurement platform. The spreading thermal conductivity Ksp of thermal conducting material can be calculated from theoretical formula. We used copper and aluminum, two materials as the standards for calibrating thermal diffusivity measurement platform and specific heat measurement platform. The results show that the error was within 10%. We further applied these experimental calibration conditions in the measurement of thermal diffusivity of vapor chambers. The experimental results show that when the measurement distance between two points was 0.03 m, the error for copper thermal diffusivity was only 1.7% compared to the standard value, while the error for aluminum thermal diffusivity was only 4.79% compared to the standard value. The spreading thermal conductivity Ksp values for the copper-based vapor chamber and aluminum-based vapor chamber were 1390 W/m · K and 608 W/m · K, respectively. Both values were higher than the spreading thermal conductivity values of pure copper or aluminum.

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