每年出版 4 期
ISSN 打印: 2151-7975
ISSN 在线: 2151-7991
APPLICATION OF FLAT PLATE HEAT PIPE FOR COOLING SPACECRAFT ELECTRONICS
摘要
Spacecraft electronics is the source of heat generation and requires proper dispersion over the base plate/deck or on the radiator surface. In most of the remote sensing spacecraft the electronics operation is intermittent and variation of heat flux needs to be absorbed first, and then transferred to the radiators. The communication spacecraft can experience continuous thermal dissipations and there is a requirement of heat spreading on the radiator over the panel. At internal to the package, there is requirements for cooling the components with high packing densities like processors, ICs (heat flux of around 2 W/cm2) etc.
The flat plate heat pipes (FHP) are recent advancements that are developed for thermal management of issues explained above. In this paper, a methodology adopted for addressing the thermal issues related to electronic
packages using the FHP is discussed. Temperature uniformity requirement for the packages, heat transfer capability, etc., are driving this study. The externally mounted electronic package with heat generation, and a component level thermal management issues are taken as examples. A generic concepts specific to these issues and their thermal simulation studies are carried-out.