图书馆订阅: Guest
Begell Digital Portal Begell 数字图书馆 电子图书 期刊 参考文献及会议录 研究收集
传热学
影响因子: 0.404 5年影响因子: 0.8 SJR: 0.264 SNIP: 0.504 CiteScore™: 0.88

ISSN 打印: 1064-2285
ISSN 在线: 2162-6561

卷:
卷 51, 2020 卷 50, 2019 卷 49, 2018 卷 48, 2017 卷 47, 2016 卷 46, 2015 卷 45, 2014 卷 44, 2013 卷 43, 2012 卷 42, 2011 卷 41, 2010 卷 40, 2009 卷 39, 2008 卷 38, 2007 卷 37, 2006 卷 36, 2005 卷 35, 2004 卷 34, 2003 卷 33, 2002 卷 32, 2001 卷 31, 2000 卷 30, 1999 卷 29, 1998 卷 28, 1997

传热学

DOI: 10.1615/HeatTransRes.2018025129
pages 349-360

A NOVEL LIQUID-PACKAGING TECHNOLOGY FOR HIGHLY RELIABLE UV-LED ENCAPSULATION

Wen-Hua Zhang
Department of Engineering and System Science, National Tsing-Hua University, Hsinchu City, Taiwan
Wei-Keng Lin
Department of Engineering and System Science, National Tsing-Hua University, Hsinchu City, Taiwan
Chih-Ting Yeh
Department of Mechanical Engineering, National Chiao Tung University, Hsinchu City, Taiwan
Song-Bor Chiang
Green Energy and Environment Research Laboratories, Industrial Technology Research Institute, Hsinchu City, Taiwan
Chih-Sheng Jao
Green Energy and Environment Research Laboratories, Industrial Technology Research Institute, Hsinchu City, Taiwan

ABSTRACT

This paper proposes a liquid-packaging technology for UV LED. Unlike the traditional packaging methods that involve thermosett ing silicon or quartz glass, the proposed method primarily uses silicon oil to directly contact the chip, which prevents erosion due to moisture or oxygen. In this study, UV LEDs with high heat dissipation technology were selected, and the experimental results of optical and thermal management were compared between the general packaging and liquid-packaging structures, respectively. The results of the optical experiments showed that the proposed method increases the extraction effi ciency by 9.5%. The results of the heat dissipation experiments showed that the liquid-packaging technology can reduce the thermal resistance of the UV-LED package by 31%.


Articles with similar content:

ETHANE TWO-PHASE THERMAL CONTROL HARDWARE (HP, LHP) FOR CRYOGENICS APPLICATIONS
Heat Pipe Science and Technology, An International Journal, Vol.5, 2014, issue 1-4
M. Molina, Donatas Mishkinis, Joaquin Melendez, Alejandro Torres, E. Turrión
CFD Analysis of Desktop Heat Sink
Journal of Enhanced Heat Transfer, Vol.15, 2008, issue 3
T. K. K. Reddy, Panitapu Bhramara, K. Prashanth Reddy
DEVELOPMENT OF A CFRP RADIATOR WITH INTEGRATED LOOP HEAT PIPE TUBING
Heat Pipe Science and Technology, An International Journal, Vol.1, 2010, issue 3
Eric Markestein, Reinhard Schlitt, Achim Pistorius, Frank Bodendieck
DAYTIME RADIATIVE COOLING WITH POLYMER COATINGS
International Heat Transfer Conference 16, Vol.22, 2018, issue
Aikifa Raza, Tawadud AlKatheeri, Jin You Lu, TieJun Zhang
EFFECTIVENESS OF COMBINED SUBCOOLER-CAPILLARY BLOCKER DEVICE IN LHP FOR SPACE APPLICATIONS
Heat Pipe Science and Technology, An International Journal, Vol.6, 2015, issue 3-4
Donatas Mishkinis, Anatoly P. Lukisha